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歐盟ROHS檢測整合最快可在7天內完成,我司擁有自身的LVD和EMC及化學實驗設備,以部份國家對六種有害物質限值與豁免
一、鎘的法規要求:
⒈ 歐盟:
ROHS,91/338/EEC,94/62/EC,76/769/EEC Limit=100ppm
瑞典:Limit=75ppm(mg/kg)
丹麥:Limit=75ppm(mg/kg)
瑞士:Limit=100ppm(mg/kg)
荷蘭:Limit=100ppm(mg/kg)
⒉ ROHS豁免項:除了91/338/EEC禁止使用的產品除外,生產設備、機器等產品的電鍍鎘可以豁免.
二、鉛的法規要求:
⒈ 歐盟:
76/769/EEC,89/677/EEC:禁止使用
94/62/EC:<100ppm
ROHS:<1000ppm
⒉ ROHS豁免項:
玻璃:如熒光管etc.
合金:鋼合金中鉛含量<0.35%(3500ppm);
玻璃:如熒光管etc.
合金:鋼合金中鉛含量<0.35%(3500ppm);
鋁中鉛含量<0.4%(4000ppm);
銅合金中鉛含量<4%(40000ppm)
焊錫:高溫融化的焊料中的鉛(即錫鉛焊料合金中鉛含量超過85%);
用于服務器、存儲器和存儲系統的焊料中的鉛(豁免準予至2010年);
用于交換、信號和傳輸,以及電信網絡管理的網絡基礎設施設備中焊料中的鉛;
電子陶瓷產品中的鉛如壓電陶瓷.
⒊ ROHS豁免聽證項:
光學玻璃及護目鏡可以使用鉛及鎘;
兩個以上焊接口之微處理器封裝跟其針頭,可使用鉛占85%比重的錫鉛焊料,唯其期限到2010年;
溶解度較高的含鉛焊料(如錫鉛焊合金有85%的鉛)及任何需要低溫焊接以完成電力接駁的焊料.
三、汞的法規要求:
⒈ 歐盟:
76/769/EEC,89/677/EEC:禁止使用;
94/62/EC:<100ppm;
ROHS:<1000ppm.
⒉ ROHS豁免項:
熒光燈及燈具.
四、六價鉻的法規要求:
⒈ 歐盟:
76/769/EEC:禁止使用;
94/62/EC:<100ppm;
ROHS:<1000ppm.
1999/179/EEC,2002/EEC:<10ppm
⒉ ROHS豁免項:
碳鋼中的防腐劑,電冰箱制冷劑中的防腐劑.
⒊六價鉻的注意點:對金屬件及其電鍍件樣品,測試的是樣品表面的六價鉻,因此其濃度計算方法有兩種.
按照JIS H8625標準,計算單位面積含量.取約100cm2樣品測試;該方法要求>10ug/100cm2
按照某些公司標準,計算電鍍層中含量.
五、溴化阻燃劑的法規要求:
⒈ 溴化阻燃劑包括:多溴聯苯(PBBS) ;多溴聯苯醚(PBDES,PBBES,PBDOS.)
⒉ 應用范圍:印刷電路板,塑料及涂層中耐燃劑,電線電纜,樹脂類電子元件.
⒊ 歐盟國家:
ROHS:<1000ppm;
76/769/EEC,83/264/ EEC:禁止使用;
2003/11/EEC:禁止使用.
及資深的工程隊伍,竭誠為您服務.
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歐盟將對RoHS指令的豁免清單具體如下(請我公司英文專家對下列譯文進行審核,如有問題,請跟貼,謝謝!):
1.Linear incandescent lamp(線型白熾燈);
2. Mercury in switches(開關中的汞);
3.Special ICs having tin-lead solder plating on leads used in professional equipment(專業設備中所含鍍有鉛錫焊料的鉛的特殊集成電路)
4.Specific modular units including tin-lead solder being used in special professional equipment(特殊專業設備中包含鉛錫焊料的特定組合單元);
5.Solders containing lead and /or cadmium for specific applications where local temperature is higher than 150 deg C and which need to work properly more than 500 hours(局部溫度超過150℃且需要正常工作500小時以上的特定用途的含有鉛和/或鎘的焊料);
6.Lead in solder for printed circuit boards for emergency lighting products(應急照明產品中印刷電路板所用焊料中的鉛
7.Hexavalent chromium (Cr-VI) in chromate conversion coatings as surface treatment(表面處理用鉻酸鹽轉化涂層中的六價鉻);
8.Lead in gas sensors(煙霧探測器中的鉛);
9.Concerning of PbO (Lead in Seal Frit) used for making BLU (Back Light Unit) Lamp(與用于制造背景燈的PbO(密封釉料中的鉛)相關的);
10. Cadmium in opto-electronic components(光電元件中的鎘);
11. Non-consumer mechanical power transmission systems including speed reducers and mechanical couplings which rely on electrical/electronic components for safe control and operation(依靠電子/電器元件來進行安全控制和操作的減速器和機械連接器等非消費型機械式能量傳遞系統);
12. Electrical and electronic components contained in heating ventilating and air conditioning building systems, commercial refrigeration systems and transport refrigeration systems(加熱通風和空調建筑系統、商用冷卻系統和運輸冷卻系統中的電子和電器元件);
13. Cadmium-bearing copper alloys(含鎘的銅合金);
14. Electrical/electronic components contained mobile and stationary air compressors and vacuum systems, compressed air contaminant removal systems and pneumatic contractor’s air tools(含有電子/電器元件的移動和固定空氣壓縮機和真空系統、壓縮氣體污染物清除系統和氣動壓縮機的氣體工具);
15. Electrical/electronic equipment that are: used in transport -aviation, aerospace, road, maritime, rail; installed in to the fabric of buildings ? elevators, escalators, moving walks, dumb waiters, and heating, cooling and ventilation systems, and fire and security systems; used in the energy generation and transmission; used in mining and mineral processing; used for non-consumer mechanical power transmission systems; industrial process pumps and compressors; used in industrial refrigeration; and used in military applications(以下電子/電氣設備:航運、航天、道路、海運、鐵路中使用的;建筑物構造??電梯、電動扶梯、移動走道、小型運貨升降機、加熱、冷卻和通風系統、防火安全系統中安裝的;能量產生和傳輸中使用的;采礦和礦石加工中使用的;非消費型機械式能量傳遞系統中使用的;工業作用泵和壓縮機;工業制冷用的;軍事設備中使用的);
16. Lead alloys as electrical/mechanical solder for transducers used in high-powered professional and commercial loudspeakers(大功率專業用和商用擴音器中的傳感器中作為電氣/機械焊料的鉛合金);
17. Cadmium oxide(氧化鎘);
18. Solder tin of the thermo fuse with a defined low melting point(有固定低熔點的溫度保險絲中的錫焊料);
19. Lead in lead oxide glass used in plasma display panel (PDP)(氧化鉛玻璃等離子顯示器面板中使用的鉛);
20. Lead in solder on small PCB and tinned legs of primary components(小型印刷電路板和初級元件的鍍錫引線所用焊料中的鉛);
21. Use of the not lead free component NEC V25 in the Memory 2000(2000年備忘錄中非無鉛元件NEC V25的使用);
22. Lead used in shielding of radiation for Non Medical X-ray equipment(非醫用X光機的射線防護屏中使用的鉛);
23. Lead based solders sealed or captured within heat-shrinkable components and devices(熱收縮性元件和設備中密封或俘獲的鉛基焊料).

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